SANTA CLARA, Calif. – At its North America Technology Symposium, TSMC (Taiwan Semiconductor Manufacturing Company) unveiled its next cutting-edge logic process technology, A14.
This advancement is from its industry-leading N2 process, designed to drive AI transformation forward by delivering faster computing and better power efficiency. The hope is to enhance smartphones and onboard AI abilities,
The process is scheduled to start production in 2028 and is ahead of yield production earlier than anticipated.
A14 promises
- 15% speed improvement at the same power
- 30% less power at the same speed
- 20% increase in logic density
TSMC is also evolving its TSMC NanoFlex™ standard cell architecture to NanoFlex™ Pro, which should bring greater performance, power efficiency, and design benefits.
Chairman and CEO of TSMC, Dr. C.C. Wiew states, “TSMC’s cutting-edge logic technologies like A14 are part of a comprehensive suite of solutions that connect the physical and digital worlds to unleash our customers’ innovation for advancing the AI future.”
What else did they announce? The company also debuted new logic, specialty, advanced packaging and 3D chip stacking technologies across High Performance Computing (HPC), Smartphone, Automotive, and Internet of Things (IoT).
Highlights
- HPC: Plans to bring 9.5 reticle size CoWoS to mass production in 2027. TSMC’s SoW-X also with CoWoS to create wafer-sized system that is estimated at 40x the current power.
- Smartphone: N4C RF will deliver 30% power and area reduction versus N6RF+, which is scheduled to enter production in 2026.
- Automotive: N3A process is entering production for automotive applications, with all technologies for automated vehicles.
- IoT: Plan to use N4e target to continue power usage for future technology.
TSMC, founded in 1987, is a foundry that revolutionized the semiconductor business model and supports a global team.
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